MODSIM

Packaging OEM Magazine Interviews Dassault Systèmes

Packaging OEM Magazine interviews Ray Wodar from Dassault Systèmes about how CPG brand manufacturers can accelerate sustainable packaging development.

Using MODSIM for CPG Packaging

Modeling & Simulation (MODSIM) can lightweight packaging while optimizing for time, cost, quality and sustainability.

Celebrating a summer of innovation in sports

Modeling, simulation, new materials design and virtual twin technology are powering new innovations in sports and sports-related industries and enhance experiences for both casual sports enthusiasts and dedicated athletes.

Integrate modeling and simulation (MODSIM) in product development to prevent failures

Thermal Behavior of Vehicle Seats: Using Simulation to Enhance Thermal Comfort

This current customer reference story aims to present a first-of-its-kind simulation workflow using a PowerFLOW-PowerTHERM coupled simulation to assess the thermal behavior of a vehicle seat provided by Lear Corporation.

Fear of failure? Virtual twins offer an antidote

Learn how science-based MODSIM provides an environment for experimentation and innovation where there there’s no need to fear failing.

The Evolution of MODSIM: From Concept to Application

Explore the fascinating evolution of MODSIM from a theoretical concept to a powerful, integrated application revolutionizing industries.

Why the High-Tech Industry Needs Multiphysics Simulation

The High-Tech industry is fast-moving and constantly reinventing itself in the face of trends such as wearables, VR/AR, private wireless networks and 5G and the coming 6G. Manufacturers face considerable challenges if they want to stay ahead of these trends and remain competitive. We spoke to several SIMULIA High-Tech industry specialists about the challenges of modern electronic design and how modeling and simulation (MODSIM) with a multiphysics approach is allowing leading manufacturers to tackle them.