[{"data":1,"prerenderedAt":105},["ShallowReactive",2],{"lAcyvXNLQ2CAl4TptCN2VBmGsmw46-1kuQxLl18Sf_M":3,"_apollo:default":103,"_apollo:identified":104},{"seo":4,"posts":15},{"social":5,"openGraph":11,"__typename":14},{"twitter":6,"__typename":10},{"cardType":7,"username":8,"__typename":9},"summary_large_image","dassault3ds","SEOSocialTwitter","SEOSocial",{"defaultImage":12,"__typename":13},null,"SEOOpenGraph","SEOConfig",{"nodes":16,"__typename":102},[17],{"id":18,"slug":19,"title":20,"uri":21,"excerpt":22,"locale":23,"featuredImage":26,"tableOfContents":34,"content":44,"date":45,"translations":46,"author":47,"tags":60,"globalTags":74,"brands":77,"keywords":88,"seo":91,"__typename":101},"cG9zdDozMDI1NzA=","state-of-high-tech-navigating-plm-and-ip-connectivity","State of High Tech: Navigating PLM and IP Connectivity","/brands/enovia/state-of-high-tech-navigating-plm-and-ip-connectivity","\u003Cp>As product complexity accelerates across the High-Tech and Semiconductor industries, legacy PLM systems are becoming a major barrier to innovation. From fragmented BOMs and disconnected teams to rising compliance demands and IP security risks, manufacturers need a smarter approach to product development. Explore how Next-Gen PLM, Virtual Twins and robust IP management are helping companies achieve digital continuity, improve collaboration and accelerate sustainable innovation in an increasingly complex global market.\u003C/p>\n",{"locale":24,"__typename":25},"en_US","Locale",{"node":27,"__typename":33},{"large":28,"__typename":29,"medium_large":28,"thumbnail":30,"srcSet":31,"sizes":32},"https://blog-assets.3ds.com/uploads/2026/05/next-gen-semiconductor-blog-may-2026.png","MediaItem","https://blog-assets.3ds.com/uploads/2026/05/next-gen-semiconductor-blog-may-2026-150x150.png","https://blog-assets.3ds.com/uploads/2026/05/next-gen-semiconductor-blog-may-2026-300x189.png 300w, https://blog-assets.3ds.com/uploads/2026/05/next-gen-semiconductor-blog-may-2026.png 580w","(max-width: 300px) 100vw, 300px","NodeWithFeaturedImageToMediaItemConnectionEdge",[35,36,37,38,39,40,41,42,43],"The Breaking Point for Legacy PLM|the-breaking-point-for-legacy-plm-0","A Next-Generation Approach to Innovation|a-next-generation-approach-to-innovation-1","Embracing Virtual Twins and Systems Thinking|embracing-virtual-twins-and-systems-thinking-2","Mastering Digital Continuity and Extended Bill of Materials (xBOM)|mastering-digital-continuity-and-extended-bill-of-materials-xbom-3","The Semiconductor Challenge: Mastering IP Management|the-semiconductor-challenge-mastering-ip-management-4","Bridging Technical and Business Functions|bridging-technical-and-business-functions-5","Securing the Innovation Chain|securing-the-innovation-chain-6","Designing for Sustainability and Compliance|designing-for-sustainability-and-compliance-7","Moving from Legacy to Leadership|moving-from-legacy-to-leadership-8","\n\u003Cp>Creating a modern electronic device involves coordinating mechanical engineering, software development, global supply chains and complex regulatory requirements. Hardware companies are under increasing pressure to produce smarter, more sustainable products at an unprecedented pace. However, many organizations still depend on fragmented tools and processes that struggle to manage this complexity effectively.\u003C/p>\n\n\n\n\u003Cp>To thrive, the High-Tech and Semiconductor industries need to reconsider how they manage product lifecycles and intellectual property. This blog post discusses the shift from outdated legacy systems to dynamic innovation platforms. You’ll discover why traditional Product Lifecycle Management (PLM) systems are ineffective, how virtual twins enhance agility and why Semiconductor companies must focus on comprehensive Intellectual Property Lifecycle Management (IPLM) to ensure their future success.\u003C/p>\n\n\n\n\u003Ch2 class=\"wp-block-heading\" id=\"the-breaking-point-for-legacy-plm-0\">The Breaking Point for Legacy PLM\u003C/h2>\n\n\n\n\u003Cp>For decades, hardware manufacturers have depended on traditional PLM systems to manage their engineering data. These older systems functioned as isolated vaults, primarily focused on controlling design data, part numbers and basic revisions. While they were effective for simpler products, they now hinder cross-functional collaboration.\u003C/p>\n\n\n\n\u003Cp>Legacy systems have a limited, engineering-centric perspective. They confine valuable product data within technical teams, resulting in minimal visibility for marketing, sourcing, or manufacturing departments. This siloed approach leads to poor usability and data conversion issues. Non-engineering roles often struggle to use these tools, resulting in inefficient, slow enterprise-wide collaboration.\u003C/p>\n\n\n\n\u003Cp>Additionally, rigid sequential processes restrict agile product development. When teams lack digital continuity, they end up with fragmented Bills of Materials (BOMs) across engineering, manufacturing, and service domains. These fragmented BOMs can introduce errors, misalign stakeholders and cause significant launch delays. Companies can no longer afford to operate with systems that lack a holistic view and real-time collaboration.\u003C/p>\n\n\n\n\u003Ch2 class=\"wp-block-heading\" id=\"a-next-generation-approach-to-innovation-1\">A Next-Generation Approach to Innovation\u003C/h2>\n\n\n\n\u003Cp>To remain competitive, industry leaders are shifting toward \u003Ca href=\"https://www.3ds.com/products/enovia/next-generation-plm\">Next-Gen PLM\u003C/a>. This transition moves companies away from static data vaults and toward cloud-native innovation platforms. These modern platforms unite all disciplines across the product lifecycle, transforming engineering intent into a dynamic, shared language.\u003C/p>\n\n\n\n\u003Cp>Next-Gen PLM empowers every function involved in New Product Introduction. Marketing, sourcing, quality and compliance teams gain real-time access to the exact same context and data as the engineering department.\u003C/p>\n\n\n\n\u003Ch2 class=\"wp-block-heading\" id=\"embracing-virtual-twins-and-systems-thinking-2\">Embracing Virtual Twins and Systems Thinking\u003C/h2>\n\n\n\n\u003Cp>Modern product complexity requires a massive shift in how teams validate their designs. Next-Gen PLM includes the power of Virtual Twin Experiences. These are highly accurate, data-rich digital representations that connect virtual and real representations of products and their production systems. Virtual twins allow teams to create, simulate and optimize designs before committing any physical resources. This approach drastically reduces risk and accelerates innovation.\u003C/p>\n\n\n\n\u003Cp>Alongside virtual twins, companies must adopt Model-Based Systems Engineering (MBSE). Complex hardware requires robust systems thinking to align different engineering disciplines. MBSE tracks requirements across all system levels, ensuring teams design with precise intent and function. When you combine virtual twins with MBSE, your global teams can iterate faster and collaborate more effectively.\u003C/p>\n\n\n\n\u003Ch2 class=\"wp-block-heading\" id=\"mastering-digital-continuity-and-extended-bill-of-materials-xbom-3\">Mastering Digital Continuity and Extended Bill of Materials (xBOM)\u003C/h2>\n\n\n\n\u003Cp>Agility relies heavily on digital continuity across the entire lifecycle. A unified platform supports an xBOM strategy, coordinating multiple Bills of Materials (BOMs) across supply, engineering, manufacturing and service.\u003C/p>\n\n\n\n\u003Cp>When all stakeholders work from a consistent, contextualized foundation, you eliminate the confusion caused by misaligned spreadsheets. Digital continuity allows your business to trace customer expectations directly from initial engineering requirements through downstream execution. This closed-loop approach boosts market relevance and product quality.\u003C/p>\n\n\n\n\u003Ch2 class=\"wp-block-heading\" id=\"the-semiconductor-challenge-mastering-ip-management-4\">The Semiconductor Challenge: Mastering IP Management\u003C/h2>\n\n\n\n\u003Cp>The Semiconductor industry faces unique challenges. Market demand for connected, intelligent and autonomous systems is pushing chipmakers to innovate faster. At the same time, geopolitical shifts emphasize the need for semiconductor sovereignty. In this high-stakes environment, effective Intellectual Property (IP) management becomes the backbone of hardware innovation.\u003C/p>\n\n\n\n\u003Cp>Semiconductor companies generate vast quantities of IP. However, many struggle to track which specific IP address is associated with which delivered products. This lack of visibility makes maintaining and updating existing product lines incredibly difficult.\u003C/p>\n\n\n\n\u003Ch2 class=\"wp-block-heading\" id=\"bridging-technical-and-business-functions-5\">Bridging Technical and Business Functions\u003C/h2>\n\n\n\n\u003Cp>Managing IP involves systematic cataloging of internal and external resources. These systems must remain adaptable and user-friendly, allowing rapid iteration as project needs evolve. Companies frequently struggle to integrate IP management tools into their existing software architecture, resulting in significant gaps between technical execution and business strategy.\u003C/p>\n\n\n\n\u003Cp>An enterprise-wide IPLM system solves these integration challenges. It fosters collaboration, tracks legal compliance and aligns engineering outcomes with business goals.\u003C/p>\n\n\n\n\u003Ch2 class=\"wp-block-heading\" id=\"securing-the-innovation-chain-6\">Securing the Innovation Chain\u003C/h2>\n\n\n\n\u003Cp>Security sits at the heart of Semiconductor IP management. Hardware IP represents the most valuable asset a chipmaker owns. Robust security measures, including advanced encryption and internal governance protocols, are non-negotiable.\u003C/p>\n\n\n\n\u003Cp>A unified platform tracks system usage to prevent unauthorized access and data leakage. By embedding IP management directly into a holistic innovation platform, companies secure their partnerships and maximize the resilience of their entire supply chain.\u003C/p>\n\n\n\n\u003Ch2 class=\"wp-block-heading\" id=\"designing-for-sustainability-and-compliance-7\">Designing for Sustainability and Compliance\u003C/h2>\n\n\n\n\u003Cp>Regulatory complexity is accelerating across global markets. Environmental mandates, safety standards and cybersecurity laws require precise auditability. High-Tech manufacturers must embed compliance readiness directly into their design fabric.\u003C/p>\n\n\n\n\u003Cp>Next-Gen PLM provides real-time traceability for global frameworks such as RoHS, REACH and ISO 26262. Proactive risk management reduces the heavy burden of validation and speeds up certification processes.\u003C/p>\n\n\n\n\u003Cp>Industries with short product lifecycles, such as consumer electronics, are under significant environmental scrutiny. As a result, circular innovation has become essential. Manufacturers need to design products with their carbon footprint and end-of-life considerations in mind. Cloud-native PLM platforms integrate circularity into the development process. This allows teams to evaluate factors such as material sourcing, repairability and recyclability and to conduct lifecycle assessment (LCA) throughout all stages of design and development. This proactive approach helps reduce e-waste and opens up new business models centered around parts recovery and remanufacturing.\u003C/p>\n\n\n\n\u003Ch2 class=\"wp-block-heading\" id=\"moving-from-legacy-to-leadership-8\">Moving from Legacy to Leadership\u003C/h2>\n\n\n\n\u003Cp>Transitioning to a modern innovation platform is a strategic journey that requires strong leadership and alignment across the organization’s culture. Treating this change as a collaborative process is essential for long-term success.\u003C/p>\n\n\n\n\u003Cp>To begin this transition, follow these actionable steps:\u003C/p>\n\n\n\n\u003Col class=\"wp-block-list\">\n\u003Cli>\u003Cstrong>Assess Organizational Readiness: \u003C/strong>Evaluate your current systems and your team’s capacity to support real-time data reuse. Identify specific usability gaps that may be slowing down your innovation cycles.\u003C/li>\n\n\n\n\u003Cli>\u003Cstrong>Engage Beyond Engineering:\u003C/strong> Involve stakeholders from sourcing, manufacturing, marketing and compliance in the PLM conversation early on. Ensure that your new processes support the entire product lifecycle.\u003C/li>\n\n\n\n\u003Cli>\u003Cstrong>Adopt Systems Engineering:\u003C/strong> Move away from document-based design. Implement Model-Based Systems Engineering (MBSE) practices to create a shared understanding of product functions and performance.\u003C/li>\n\n\n\n\u003Cli>\u003Cstrong>Pilot Virtual Twins:\u003C/strong> Launch targeted pilot programs to validate the real-world benefits of simulation-based decision-making. Use these pilots to build momentum within your organization.\u003C/li>\n\n\n\n\u003Cli>\u003Cstrong>Align on Experience-Driven Outcomes: \u003C/strong>Shift your key performance indicators away from simple technical milestones. Focus on customer experience, sustainability and lifecycle performance.\u003C/li>\n\u003C/ol>\n\n\n\n\u003Cp>\u003C/p>\n\n\n\n\u003Cp>Embracing a systems-driven, cloud-enabled innovation platform will help companies to future-proof their operations. By focusing on digital continuity and effective intellectual property management, organizations can navigate industry complexities and lead sustainable hardware development efforts.\u003C/p>\n\n\n\n\u003Cp>\u003Ca href=\"https://www.3ds.com/industries/high-tech/virtual-twins-enterprise-ip\">Discover more\u003C/a>. \u003C/p>\n","2026-05-19T20:56:48",[],{"node":48,"__typename":59},{"nicename":49,"description":50,"slug":49,"name":51,"firstName":52,"lastName":53,"avatar":54,"__typename":58},"nancyoflaherty","","Nancy O'Flaherty","Nancy","O'Flaherty",{"default":55,"url":56,"__typename":57},"mm","https://secure.gravatar.com/avatar/fabadd8b03d48575451f16d8e8a3a3d8b0de8761d35dd0088e0caf35c49a5a6f?s=96&d=mm&r=g","Avatar","User","NodeWithAuthorToUserConnectionEdge",{"edges":61,"nodes":69,"__typename":73},[62],{"isPrimary":63,"node":64,"__typename":68},true,{"slug":65,"name":66,"__typename":67},"cloud","Cloud","Taxonomy_topic","PostToTaxonomy_topicConnectionEdge",[70],{"id":71,"name":66,"uri":72,"__typename":67},"dGVybTo4MTA2","/topics/cloud/","PostToTaxonomy_topicConnection",{"nodes":75,"__typename":76},[],"PostToTaxonomy_tagConnection",{"edges":78,"nodes":85,"__typename":87},[79],{"isPrimary":63,"node":80,"__typename":84},{"slug":81,"name":82,"__typename":83},"enovia","ENOVIA","Taxonomy_brand","PostToTaxonomy_brandConnectionEdge",[86],{"name":82,"slug":81,"__typename":83},"PostToTaxonomy_brandConnection",{"nodes":89,"__typename":90},[],"PostToTaxonomy_keywordConnection",{"title":92,"metaDesc":93,"opengraphAuthor":50,"opengraphDescription":93,"opengraphTitle":20,"opengraphUrl":94,"opengraphSiteName":95,"opengraphPublishedTime":96,"opengraphModifiedTime":97,"twitterTitle":50,"twitterDescription":50,"readingTime":98,"metaRobotsNoindex":99,"__typename":100},"State of High Tech: Navigating PLM and IP Connectivity - Dassault Systèmes blog","Discover how the High-Tech and semiconductor industries are overcoming modern complexity with Next-Gen PLM, Virtual Twins and robust IP management.","https://blog-frontoffice-contrib-prd.itvpc.3ds.com/brands/enovia/state-of-high-tech-navigating-plm-and-ip-connectivity/","Dassault Systèmes blog","2026-05-19T20:56:48+00:00","2026-05-19T20:56:52+00:00",6,"index","PostTypeSEO","Post","RootQueryToPostConnection",{},{},1779226315879]